Effects of In Situ Modification of Aluminum Fillers on the Rheological Properties and Thermal Resistance of Gel Thermal Interface Materials

Thermal interface materials (TIMs) used to fill the gaps between chip and heat sink are one of the most important materials for electronic packaging. Low thermal resistance is the key to achieving high heat dissipation efficiency. However, most studies only focused on how to enhance the thermal conductivity of the gel TIMs and ignored the thermal resistance, which is significantly influenced by the rheological properties. In this work, we aimed to investigate the effects of
in situ
modification of aluminum fillers on the rheological properties and thermal resistance of the gel TIMs. Six modifiers were compared for their ability to improve the compatibility between aluminum fillers and silicone oil. The rheological results showed that the gel TIM modified with 0.170 wt% dodecyl trimethoxysilane had the best rheological properties, including the lowest viscosity and yield stress, the weakest Payne effect, and the shortest relaxation time. The thermal resistance measurements further verified that the bond line thickness and thermal resistance of gel TIMs were determined by the rheological properties. This work provides a reference for the formulation design and process optimization of gel TIMs.