Scalable Through Molding Interconnection realization for advanced Fan Out Wafer Level Packaging applications

This study demonstrates the feasibility of a through molding interconnection (TMI) process for which the height can be easily expanded according to the needs of the future application. These TMIs constitute the vertical interconnects required for 3D packaging, in particular in fan out wafer level packaging (FOWLP) and 3D package on package (PoP) approaches. A simple process has been developed for the realization of TMIs with unprecedented height/pitch ratios. This paper describes the realization of 225 μm high interconnects with a pitch of only 100 μm. The performance of these TMIs is evaluated by morphological and electrical characterizations and aging tests. All these characterizations demonstrate electrical performances and robustness in line with the expectations for vertical interconnections in 3D packages.