New Packaging Technology for Disruptive 1- and 2- Dimensional VCSEL Arrays and Their Electro- Optical Performance and Applications

In this paper we present the manufacturing workflow and look at the challenges presented by the packaging of special long-wavelength 1- and 2-dimensional Vertical Cavity Surface Emitting Laser Diodes (VCSEL) arrays in the dimension of 230 by 1200μm
²
for the 1-D and 1 by 2 mm
²
for the 2-D arrays. The focus rests on the development of the major processes used for the assembly of these diodes and their contribution to the reliability of the final product. We will show that available packaging technologies for epoxy application by silk screening, die- and wire bonding can be adapted for the unique properties of the VCSELs, delivering high accuracy for automated production with great overall yield. Proof of the excellent reliability and lifetime will be given through mechanical and electro-optical testing results. The technologies developed for laser arrays will enable new devices for various new applications like high channel count interconnects for data communication and high power VCSEL solutions for 3D sensing.