A Heterogeneously Integrated and Flexible Inorganic Micro-display on FlexTrate™ using Fan-Out Wafer-Level Packaging

We demonstrate heterogeneous integration of GaN microLEDs with driver and resistor components at fine wiring pitches (~20 um) to form a monochrome display using FlexTrate
^TM
, a flexible, die-first, fan-out wafer level packaging (FOWLP) platform. Furthermore, quantum dots were deposited on a separate PDMS layer and used to convert monochrome blue wavelength to red and green wavelengths to demonstrate the effectiveness of color conversion technology to achieve a passive matrix driven RGB display. Spectrum and power analysis reveal its viability in achieving a full passive-matrix RGB display featuring reduced processing time and cost while preserving the Pixels Per Inch (PPI) aspect of the display.