A Placement-Oriented Mitigation Technique for Single Event Effect in Monolithic 3D IC

In this paper, we propose a new placement technique that takes advantage of the multi-tiers feature of 3D technology to increase the reliability of 3D designs. The proposed algorithm performs a transient effect analysis to identify the error-sensitive sequential components of the design. These components are allocated in the inner tier to reduce the soft error susceptibility of the circuit, exploiting the shielding effect of the outer tier on reducing the SEU cross-section of the component of the inner tier and performing an oculate placement to reduce the effect of secondary transient pulses. Experimental analyses performed by simulation on different benchmark circuits demonstrate the reduction in radiation-induced error sensitivity.