Unique multi -level metal layer electronics solutions offered by advanced 3D printing

Integrated additively manufactured electronics (AME) is a novel manufacturing technique enabled by the recent progress in simultaneous 3D printing of dielectric materials and conductive inks with flexible interlayer distance. This capability allows for the realization of complex passive electronics and antenna elements as a one-stop-shop for circuit-in-package applications. Specifically, we will address the capabilities of the DragonFly^TM LDM system to realize high-frequency applications such as multilayer bandpass filters [1], and multi-layer stacked antennas for millimeter-wave with superior integration capabilities to achieve smaller form factors [2], but also to enable the realization of vertically stacked metamaterial approaches [3]. In addition, the fabrication can take place at low temperature.