Yield learning and volume manufacturing of high performance logic technologies on 200 mm and 300 mm wafers

This paper describes the rapid yield learning and high volume ramp of Intel's 130 nm logic technology on both 200 mm and 300 mm wafers. This process technology delivers industry leading performance, yield, reliability and density that is matched on both 200 mm and 300 mm wafers. This technology supports SRAM cell sizes down to 2 /spl mu/m/sup 2/ and has produced >10 M high speed microprocessors at the time of this publication.