3D X-Ray Microscope Applied on Fine-Line Inspection of Fan-Out Packages

Here, we report the sample preparation and electrical test for failure analysis. The failure analysis on the fan-out package with 2 μm / 2 μm fine-lines and space use 3D X-Ray to identify the submicron defect. The FIB results have verified the defect less than 1μm and the 3D X-Ray capability is useful on 2 μm fine-line packages.