Novel Method for Measuring High Temperature Hygroscopic Swelling

Electronic packaging reliability is known to be affected by humidity from the environment. Absorbed moisture can cause serious assembly issues such as warpage, delamination, and even pop-corning. However, to this day, material moisture properties are not readily available - especially at high temperatures. This paper introduces a novel method of measuring high temperature material swelling to extend the characterization capability beyond typical measurement limits. This new measurement concept has yielded some promising results and presents opportunities for future work.