Manufacture of high-strength differential pressure sensor using SiCer technology

Commonly pressure sensors are often fabricated using silicon direct bonding or anodic bonding processes. Because of that additional preparation steps must be carried out and the achieved results of a high-strength bonding interface is not always sufficient. For this reason, the SiCer technology is a great advantage due to the combination of silicon and ceramics in a common sintering process and impress with good compatibility and high bonding strength.