Advanced Low Dk and High-Density Photo- Imageable Dielectrics for RDL Interposer

Future Redistribution Layer (RDL) interposer requires low dielectric constant (Dk) and high density RDL layers to improve signal and power integrity in high- performance computing (HPC) application. This paper proposes alkali-developable photo-imageable dielectrics (PID), FG-Series with low Dk of 2.9 at 10GHz, which enable 2μm-via patterning and provide biased high accelerated stress test (b- HAST) resistance on 2μm-L/S Cu traces. FG-series is promising candidates to enable low signal delay, high density and good reliability for RDL interposer.