Subcooled boiling in a liquid chamber for high heat flux cooling

A compact cooling device, which can remove a high heat flux, is needed for next-generation electronics, such as power semiconductors. Boiling heat transfer (BHT) is a promising cooling technology because the heat transfer coefficient of BHT is much higher than that of conventional single-phase flow cooling. On the other hand, boiling characteristics using a compact vessel must be investigated to downsize the cooling devices using BHT. In this study, subcooled boiling characteristics are investigated using a liquid chamber. In particular, the control method of liquid subcooling in the liquid chamber was experimentally examined. As a result, the experimental result suggests that the liquid subcooling should be kept at high to remove a high heat flux using microbubble emission boiling even when a liquid chamber was operated at low pressure with water.