Design and research of automated batch cutting equipment for PCB substrate

To reduce the bond failure rate of welding spot in integrated circuit, a cutting equipment with high precision, high efficiency and small deformation plays an important role in printed circuit board (PCB) manufacture, So PCB substrate cutting equipment is one of the key process equipment. A kind of feeding, cutting and packaging integration was studied. Siemens programmable logic controller (PLC) was used to coordinate all modules to operate efficiently and stably. Thus, automation of cutting and packaging was obtaining and its speed was up to 9 pieces per minute. The results show that the cutting equipment is of high stability and efficiency, leading to improvement in cutting rate and packing efficiency of PCB substrate. It also saves manpower resources, improves safety and environmental protection. This was beneficial to further optimization design of automated batch cutting equipment.