Modeling and Measurement of Double Stacked Microvia in Antenna-in-Package Module for 5G mmWave Applications

In this paper, a double stacked microvia (DSV) in a novel Antenna-in-Package (AiP) system integration platform (SiP) is investigated for 5G millimetre-Wave (mmWave) applications. To demonstrate the performance of the DSV as a vertical interconnect element in printed circuit board (PCB) based AiP, DSV along with conductor-backed co-planar waveguide (CB-CPW) were modelled to achieve optimum performance. The designed structures were fabricated and measured. Very good correlation was obtained between measurement and simulation. The fabricated DSV along with CB-CPW has an insertion loss of less than 0.3 dB up to 40 GHz.