Depositon of Micrometer-Size Features on Complex Substrates for Heterogeneous Integration

We demonstrate a novel Ultra-Precise Deposition (UPD) technology for heterogeneous integration in advanced packaging and printing interconnections on flexible substrates. UPD allows maskless deposition of highly-concentrated pastes on complex substrates. The printing resolution is in the range from 1 to 10 µm. The ink viscosity is up to 2,500,000 cP, which corresponds to 85% wt. of metal content and the electrical conductivity of printed structures is up to 45% of the bulk value. This technology is designed for rapid prototyping and manufacturing of next-generation printed and flexible electronics devices, including sensors, integrated circuits, displays, and energy harvesting systems.