Performance Evaluation of 3D Memory-Logic Hybrid Bond Stacking by RLC Delay Model for Edge Computing Applications

Edge computing has been realized through the advanced 3D memory-logic packaging technologies with higher bandwidth and lower power consumption. The necessity of the inductor in the theoretical calculation of 3D IC electrical performance is clarified by comparing RLC and RC delay model. 3D face to back hybrid bond stacking improves 60 times in the bandwidth density and 6 times in the power efficiency, compared with the 3D micro bump stacking. The key factors to improve each index are also reported.