A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability

Aggressive technology scaling coupled with an insatiable need for high-performance microprocessors has led to a significant increase in power dissipation in integrated circuits. This has, in turn, led to an increase of within-die thermal gradients. In this paper, we present a novel approach of assessing the impact of spatial and temporal hotspots on the chip-package interaction (CPI) reliability of microprocessors using an on-die ring oscillator (ROSC) based heater. The ROSC design enables the generation of temperature hotspots with power densities exceeding 3000 W/cm
²
, allowing assessment of its impact on CPI reliability. The fast response of the ROSC heater enables high-frequency thermal cycling, which can be used to assess CPI reliability for cycle counts of the order of a few million. This methodology can be used to mimic the thermal cycling behavior of microprocessors under realistic workloads and can be used as a tool to improve confidence in thermo-mechanical reliability.