Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for automotive MOSFET applications

Experimental investigations for performing design optimization and life cycle assessment during the development of high-tech components are costly and time consuming. Hence, they are preceded by finite element simulations. Mathematical methods of model order reduction can speed-up the simulation time significantly and thus, enable system level simulation. In this paper we demonstrate how model order reduction can be applied to a linearized, coupled domain thermomechanical packaged chip finite element model. The resulting reduced order model is built using Krylov subspace based model reduction technique and exhibits an outstanding accuracy. Furthermore, at the system level it can be connected to the lumped element electrothermal MOSFET model in order to provide it with realistic time-variable boundary conditions.