Deep Reactive Ion Etching of Device Layer during Manufacture Micromechanical Accelerometer

During manufacture of the micromechanical accelerometer one of the most important processes is connected with the structure formation of the device layer. Within the discussed research it was proposed to use the deep reactive ion etching to execute operation. Standard methodology and criteria for the evaluation of geometric parameters of the etching profiles were applied. The optimal mode of the etching process that was experimentally determined during the creation of the device layer with the required topology of the micromechanical accelerometer is presented.