Analytical thermal model for multilevel VLSI interconnects incorporating via effect

The authors present compact analytical thermal models for estimating the temperature rise of multilevel VLSI interconnect lines incorporating via effect. The impact of vias has been modeled using (1) a characteristic thermal length and (2) an effective thermal conductivity of ILD (interlayer dielectric), k/sub ILD,eff/, with k/sub ILD/,/sub eff/=k/sub ILD//spl eta//, where /spl eta/ is a physical correction factor, with 0