3D sequential integration: applications and associated key enabling modules (design & technology)

3D sequential integration (3DSI) is envisioned for highly miniaturized smart imagers and fine pitch logic and memory imbrication. This paper describes partitioning in 3DSI and design methodologies. A status is also done on low temperature processes and device performance adapted for these applications (i.e. digital
$\mathrm{V}_{\text{DD}}\leq 1\mathrm{V}$
and analog
$\mathrm{V}_{\text{DD}}\geq 2.5\mathrm{V}$
devices).