Application of Silicon Piezoresistive Effect in Mems Embedded Microlfuidic Cooling

The multi-sensor fusion test vehicle is proposed to evaluate the mechanical properties in embedded microfluidic cooling. According to the principle of silicon piezoresistive effect, thermal/stress test chip (TSTC) and TSV pressure sensors are fabricated. It is successfully demonstrated the implanted pressure sensors improves the accuracy of pressure data. In addition, the thermal stress caused by local hotspot and the mechanical stress caused by coolant impact together lead to uneven stress distribution on the chip surface. The application of silicon piezoresistive units in embedded microfluidic structure can be used as an important methods for cooling performance and reliability analysis evaluation.