Embedded Microchannel Cooler with Manifold for IC Chips

This work reported a method for embedding jet impingement micro-structures into an integrated circuit (IC) chip's substrate. The IC chip can keep the junction temperature less than 120°C at high power density (2200 W/cm
²
) using this method. Trapped by traditional chip packaging and heat dissipation methods, the inability to remove dissipated heat has led to the clock frequency stabilized at around 3 GHz, and the gate array ratio is also strictly controlled within 20%. Our method is expected to increase the computational efficiency of IC chips without improving the CMOS process node.