Research on Reliability of Non-Flow Prepreg Filling in Automotive R-F PCB

With the transformation and upgrading in automotive electronic products and the popularity of new energy vehicles, more and more PCBs are used in automotive electronic system. With the advantages of being lighter, flexible, small, and of multiple functions, more and more rigid-flex board are used in vehicle electronic products. Non-flow PP is an essential material in the production process of rigid flexible board. The use of non - flow PP is to avoid the resin flow to the flexible area. Low flowing is the biggest advantage of the non-flow PP, meanwhile it is the biggest disadvantage. Because the resin flow is very low, it is easy to lead to the occurrence of measling in lamination process. Measling will cause serious reliability risk to the quality of rigid flexible board. Therefore, the application of non-flow PP in rigid flexible board is being concerned particularly by R-F PCB engineers. Due to the complexity of the stacking design of the vehicle R-F PCB, the higher requirements are put forward for the quality and reliability of the non-flow in the process of lamination. This study is aiming at non-flow PP reliability of vehicle R-F PCB, and lists the main factors which affect the reliability. In this article, we mainly study copper thickness, core thickness, non-flow PP of different resin flow, PP filling test pattern, to find how these factors affect the reliability.