Hybrid bonding enhancement system for ultra-low signal loss PCB manufacturing

In this work we introduce a new bonding enhancement system to promote the adhesion of dielectric on conductor surface. Moving away from a traditional bonding enhancement process which solely based on mechanical anchoring to more advanced hybrid bonding system which enhancing the chemical interaction between conductors and dielectrics. This chemical bonding enhancer step in the process is commonly known as adhesion promotor (AP). In this way, the surface roughness can be kept as minimum as possible, ensuring high speed transmittance of signals in electronics assembly whilst meeting industry standards for adhesion reliability. Combination of nanoscale cavities and adhesion promoter shows an excellent adhesion performance and an outstanding thermal reliability. Outperforming the performance of currently available bonding enhancement system in industry. Thanks to the minimum surface roughness of hybrid bonding enhancement system, the signal integrity performance at high frequency bandwidth is improved remarkably around 8–10 %. Showing hybrid system as the best solution for bonding enhancement of next generation PCB manufacturing where ultra-low signal loss performance is required.