Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules

The AuSn solder process is applied to optoelectronic modules using a high accuracy flip-chip bonder (Karl Suss FC150). The different requirements of the modules are matched by adjusting the metallization layers of the bond pads, the solder deposition and the bonding parameters, i.e. temperature, bond-force and hold-time.