Effect of joint strength of PbSn and AuSn solders on thermal aging in laser packages

The effect of joint strength of PbSn and AuSn solders on thermal aging in laser packages has been studies experimentally and numerically. Samples were aged at 150/spl deg/C for one, four, nine, sixteen, twenty-five, and thirty-six days. It was found that the joint strength decreased as the aging tune increased. This joint strength decreased may be due to the brittle fractures associated with void formation increased in solder joints. A finite-element method (FEM) simulation of joint strength was in reasonable agreement with the experimental measurements.