LTCC as MCM substrate: design of strip-line structures and flip-chip interconnects

LTCC multilayer substrates offer a cost-effective MCM solution for frequencies around 20 GHz and beyond. This paper reports on LTCC-specific transmission-line structures using a commercially available process. For the chip interconnect, a flip-chip approach contacting the backside is chosen, which, in a first step, is realized on conventional ceramics.