RF-microwave multi-layer integrated passives using fully organic System on Package (SOP) technology

This paper presents high-density, fully organic multi-layer interconnects and integrated passives for RF and microwave System on Package (SOP) development. The components developed in this technology include novel CPW-microstrip transitions, high Q passives, as well as a planar antenna on a package. High Q passives, designed to be implemented using the featured CPW-microstrip transitions in this organic multi-layer technology, demonstrate the feasibility of implementing SOP technology for RF and microwave applications. This technology also employs a lifted slot antenna with vertical feed to reduce loss at the feeding point and to minimize pattern distortion.