Embedded Cooling for High-heat-flux Hotspots with Different Sizes

The thermal management of a super high heat flux hot spot is critical for the utilization of the new generation semiconductor materials. Among these approaches, the embedded cooling technology has been demonstrated as an efficient way to cool the high heat flux devices. In this work, a silicon base microchannel heat sink was designed and fabricated to cool the hot spots from 50 um to 5000 um. Hotspots were set right above the inlet of the microchannel heat sink and the cooling performance of them were tested via a thermal test vehicle (TTV). The experimental results showed that our thermal management system could dissipate a heat flux of up to 20 kW/$cm^{2}$ in the hotspot of 50 $\mu m\times 50 \mu$ m while temperature rise of the heated area maintained below 270°C.