Design and Implementation of a Ka-Ku Frequency Conversion Receiver 3D SiP Module

This paper illustrates the three-dimensional SiP design based on Si substrate stacking. The SiP module is operating in Ka-Ku frequency conversion receiver, which is designed and implemented by using high-density MMIC chipset. The MMIC chipset is mainly composed of multiple low noise amplifiers, a mixer and a fixed frequency power amplifier. In order to achieve better out-of-band suppression, two kinds of filters based on GaAs substrates are designed, which are lumped are distributed components, respectively. The SiP module achieves the frequency conversion from 28˜29GHz to 19˜20GHz, and the small signal gain is greater than 25dB in the RF range, and the out-of-band clutter rejection is less than -35dBc.