High density packaging techniques for miniaturization of satellite RF and microwave subsystems: Attachments, Interconnections and Hermetic sealing

Electronics packaging is identified as the most critical step for the development of modules and subsystems operating at higher frequencies. The RF and microwave subsystems for space applications continuously go through miniaturization journey along with increasing frequency of operation and need for manufacturability. The space domain brings additional stringent environmental requirements for the subsystems to be compliant to space qualification criteria. The high density, high frequency and high reliability packages are intended to provide excellent mechanical and electrical performance in harsh space environment. This paper provides focus on the design concepts, materials and processes that are classified into three main stages viz., attachments, interconnects, and hermetic sealing with an end objective of enhancing the thermal and high frequency performance of the subsystem. The paper additionally describes some of the high density RF and microwave subsystem packaging technologies used in current and future space applications.