Design of a X-Band 2×2 Phased-Array Transceiver Module Using Chiplet Method

radio frequency (RF) microsystem, which uses advanced heterogeneous integration (hetero-structure and hetero-material integration) package, has been widely attracted. In order to acquire more efficient design of complex RF microsystem, the method of chiplet based on accurate chip model (Intellectual Property, IP) is studied in this paper. Four RF chips are modeled and applied to design a X-band phased array T/R module. Compared with traditional design, the modified method can improve simulation accuracy of module.