Mutual Coupling Reduction in THz Integrated Circuits using Cubic Micropillar Array

This paper presents a frequency selective surface (FSS) based simple and efficient technique to mitigate the electromagnetic (EM) interference in terahertz (THz) integrated circuits (ICs). Three dimensional FSS array of dielectric cubic micropillars arranged periodically along a straight line and in a square grid are presented here. Arrays exhibit narrow band rejection at THz frequencies when illuminated by EM waves incident from two orthogonal planes assuming air in between adjacent pillars. The space between the pillars is then filled by SiO2 for comparison. Later, dielectric pillars are coated by a metal layer. The transmission responses of all FSSs are presented and compared. From the full wave EM simulations, a broader band rejection is observed in presence of metal layer when compared with all dielectric surfaces. The proposed technique provides a good solution to mitigate any interference or coupling within THz ICs.