Abstract:
In order to isolate the effect of coupling between a signal via and a PCB or package cavity a novel launch setup is described and analyzed. This low cost launch consists ...Show MoreMetadata
Abstract:
In order to isolate the effect of coupling between a signal via and a PCB or package cavity a novel launch setup is described and analyzed. This low cost launch consists of using a 0.35$ USD SMA connectors soldered as surface mount to each side of a signal via. Use of hot glue melt provides mechanical stability and reduces impedance discontinuity. The proposed setup measures the true effect of how a via excites a cavity without perturbing the cavity.
Date of Conference: 13-15 December 2021
Date Added to IEEE Xplore: 27 December 2021
ISBN Information:
Contents 