Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations

An explosion of data‐centric computation is driving the need for heterogeneous integration and advanced packaging. This chapter discusses chiplet and interposer scale interconnection using stitch‐chips, or bridge‐chips and presents thermal design considerations in 2.5D and 3D integrated circuits (ICs) and describes through‐silicon vias (TSV) integration in microfluidic cooled chiplets for 3D integration. Thermal analysis and optimization have been conducted for interposer‐based 2.5D integration, and TSV‐based and monolithic 3D IC integrations. A considerable amount of literature exists on design and evaluation of micropin‐fin‐based monolithic microfluidic cooling. Inter connect density for tightly integrating multiple chiplets is driving the industry toward 2.5D integration. The chapter focuses on a central process unit‐field programmable gate array‐Memory 2.5D microsystem as a test vehicle for the bridge‐chip technology. It presents electrical and thermal design considerations and highlights unique challenges in implementation of such highly integrated electronics.