Panel‐Level Packaging for Heterogenous Integration

Heterogeneous integration is one of the most promising ways to bridge the gap between emerging microelectronics and its derived applications, and both are pushing new packaging technologies. Fan‐out wafer‐level packaging or panel‐level packaging is now the optimal result of the merge between single‐chip and multi‐chip packages. In response to the emerging trends in packaging technologies, detailed cost analysis models are required to assess the economic and environmental feasibility of different technology options, business scenarios, design options, and process configurations. The different fan‐out package types offer a cost‐effective solution for multi‐chip integration combining high‐density thin film routing being currently used for high performance Si‐interposers with embedding chips into organic substrates or epoxy molding compound. Chiplet technology is a different way of integrating multiple electrical functions in a package or system.