Technologies for Power Device Packaging by Using Solid Liquid Interdiffusion Bonding - SLID

This paper presents several approaches for bonding at low temperature with a resulting interface alloy that is stable at temperatures higher than the bonding temperature itself. The bonding principle described herewith is called Solid Liquid Interdiffusion (SLID) bonding, where two metals were used for creating an alloy. First, a low melting point metal defines the process temperature e. g. Sn, In, or Ga. With a high solubility, a second metal forms together with the first metal intermetallic phase(s) during isothermal solidification. By the concentration and the stoichiometric relation of the components the liquid phase while bonding is mainly controlled. This paper will show different material combinations and different deposition technologies for the metals used with regard to efficient fabrication processes.