Tuning Avalanche Path in Vertical GaN JFETs By Gate Driver Design

The 1.2-kV vertical gallium nitride (GaN) fin-channel junction-gate field-effect transistor (JFET) has recently emerged as a promising candidate for power electronics. It is normally off and has a specific on-resistance smaller than that of 1.2-kV SiC mosfets. A robust avalanche capability has also been reported in vertical GaN JFETs with an avalanche current flowing through the gate. This avalanche path differs from that of power mosfets (via the source) and may pose challenges in gate driver reliability. This article, for the first time, demonstrates that the avalanche current in GaN JFETs can be tuned to flow through the source, by using either a mosfet driver with a large gate resistance or an RC-interface driver. These drivers turn on the fin channel during the device avalanche and obviate a large avalanche current into the gate driver. The carrier dynamics within the GaN JFET under the two avalanche paths have been unveiled by physics-based mixed-mode electrothermal simulations. The critical avalanche energy density in both paths was found to be comparable with the state-of-the-art SiC mosfets. Additionally, the RC-interface driver was shown to outperform the mosfet driver for vertical GaN JFETs. The learning about normally off GaN JFETs was applied to a study of commercial normally on SiC JFETs. Two avalanche paths of a similar nature were observed with different gate drivers. This article provides new insights of the JFET avalanche and show the excellent robustness of the novel 1.2 kV vertical GaN JFET.