Study on the Influence of Temperature Effect on SiP Chip

The Finite Element Method is used to analyze the temperature and stress distribution of SiP chip under the effect of ambient temperature and the heating of the chip itself in order to investigate the influence of temperature effect on the structure and performance of the chip. In the analysis, the influence of heat conduction, convection and the number of layers of the underlying substrate are all considered. The results show that the maximum stress of the chip is far less than the allowable stress of the material under the premise of the temperature range and extreme power consumption of the chip, which indicates the feasibility of the chip design.