Guest Editorial Special Issue on Papers From the IEEE FLEPS Conference 2020

Printed devices on flexible and disposable substrates are receiving considerable interest for the realization of low-cost electronic and sensing systems. As a result, new methods such as resource-efficient printing and multimaterial additive manufacturing have been explored to develop a wide range of easily deployable systems such as displays, sensors, and smart tags. The technologies developed for silicon-based planar electronics and solid-state sensors are also being re-purposed to meet the demands in the emerging field of flexible and printed sensors. This trend will continue as all market indicators point towards significant growth in this area. At the same time, the rapidly growing e-waste issue and its adverse socioeconomic impact have highlighted the need for sustainable electronics and a circular economy, where naturally degradable electronics, design for sustainability, and recycle and reuse are critical factors. As a result, flexible, printed, and disposable sensor technology, solution-processable nanomaterials, and novel printing techniques are likely to bring about a new wave of green technologies. Considering these developments, it became necessary to provide a forum to discuss the latest developments in the field and to bring together the academic and non-academic sectors to carefully lay the future roadmap. The IEEE International Conference on Flexible, Printable Sensors and Systems (IEEE FLEPS) provides such a forum and aims to be the premier conference in the world. The high standards of the conference are ensured by the directions set by the steering, organizing, and technical committees formed by world-leading experts in the field.