Recent Technology Trends in Satellite Communication Subsystems

A satellite is a complex arrangement of payloads, sensors, solar panels, antennae, and several electronics packages, all of which must coexist in a confined space, communicate with each other, and be controlled from the ground. One of the classifications of these subsystems is Mechanical and Electronics and another classification is Satellite Bus Subsystems and Payload Subsystems. The Communication Subsystems are responsible for Communicating with the ground for house-keeping functions or Payload functions. Typical components included receive antennae, receivers, Low Noise Amplifiers (LNA), filters, RF switches, transponders and transmit antennae that operate at S, C, X, Ku, and Ka bands. The ever-increasing demand of reduced size, increased efficiency of communication subsystems, has driven the technological improvements in electronic devices, substrates, materials, and interconnection mechanisms. The digitization of the payload functions of a satellite is necessitating the use of digital subsystems into the communication chain thus merging the high-speed digital and RF domains on a single board. This review article highlights recent developments in various communication subsystem configurations of satellites, trends in technologies starting from components to modules and subsystems, design considerations and system level performances. Use of latest Microwave Integrated Circuits (MIC), Microwave Monolithic Integrated Circuits (MMIC) and Low Temperature Co-Fired Ceramic (L CC) and focus on novel packaging technologies are discussed along with onboard performance and qualification journey on ground.