Research on welding technology of surface mount device on high integration substrate

With the development of T/R modules towards miniaturization, high density, reliability and performance, the mixed assembly technology is frequently used in the assembly processing of T/R module. This paper mainly introduces the welding technology of surface mount device after the welding of the large area substrate of T/R module, and studies the influence of the thickness of the stencil of different sizes on the welding effect of the surface mount device. The result shows that the manual printing stencil is more than 4 times faster than manual coating solder paste and the welding effect is best with 0.07mm stencil.