TSV-based cross-coupled SIW THz bandpass filter with quadrangle components topology

Based on Through-Silicon Via (TSV) technology, a cross-coupled Substrate Integrated Waveguide (SIW) filter with quadrangle components topology is presented for Terahertz (THz) band. Based on generalized Chebyshev filters theory, the proposed filter performance is converted into the form of an initial cross-coupled matrix. In addition, a series of coupling matrix reconfiguration is the key for quadrangle components cross-coupled topology. The presented results reveal that the proposed filter has the center frequency f
0
of the passband at 0.368 THz with bandwidth of 0.0193 THz. The insertion loss and return loss across the passband are -2.0 dB and -11.4 dB, respectively. Further, the out-of-band rejection is better than 25 dB with frequencies up to 1.089 f
0
.