Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC

3D integrated circuits (3D ICs) based on through- silicon vias (TSVs) are widely used as a solution to solve the interconnect and power problems in IC design. However, as the structures of 3D ICs become more complex, testing has emerged as an important challenge. It is difficult to test power and ground TSVs because they are connected to a grid after stacking. In this paper, a built-in self-test architecture for power and ground TSVs is proposed. This architecture tests for three types of TSV faults that are critical to the operation of TSVs. The proposed test architecture can improve the reliability of 3D stacked IC by providing a suitable test for power and ground TSVs with little hardware overhead.