Power Delivery Noise Measurement Technique for Xeon Validation

This paper addresses power delivery noise measurements for high frequency using package top side probe (TSP) to guarantee that the silicon specifications are met. This work aims to enable upcoming products with alternate procedures to unmask the effects of high-frequency power delivery measurements with open termination. The paper also describes the impact of the TSP termination on low-frequency noise measurements and how to correct the problem. The proposed techniques were confirmed with measurements from two different Xeon server products: 14nm and 10nm.