Meniscus interface etching of silicon in KOH in a hands-on introductory course in MEMS

We describe a bulk micromachining technique for etching one side of a silicon wafer in KOH without the need for substantial protection of features on the opposite side. The approach uses meniscus properties of the etchant to draw fluid to the surface of a wafer that is suspended above the bath. Complete etching through the wafer is possible. This technique has been developed as part of a new course in MEMS that is also briefly described.