Optimum Heatsink Selection of Chip on Film

In this study, an observation and comparison between different heatsinks for COF applications on display technologies. COF packaging technology is widely used in LCD drivers for televisions. For this application, a COF IC has been chosen for this study and six different heatsinks were evaluated and their thermal performances has been compared between no heatsink application on COF IC. This study shows that graphite heatsink had the best thermal cooling performance when compared with other heatsinks.