Overview of the Electronics Redesign of the multi-Needle Langmuir Probe System

A single chip ASIC solution is being developed for the University of Oslo’s multi-Needle Langmuir Probe system, which currently uses a multi-chip architecture. It has been in development since 2017, and is presently being characterized and tested in an electronics lab as well as a plasma chamber. The units under test consist of two generations of ASIC chips that both use high voltage XFAB technology alongside ADC and DAC chips provided by well established manufacturers that are used as reference. All components are on a single PCB that is used for each testing condition. An overview is given of the current status of the project, along with future testing procedures and outlook.