Uniformity of Electrochemical Deposition on Thin Copper Layers

In this paper the influence of the thickness of electroless copper layers on the uniformity of electrochemical thickening is investigated. Three different electroless baths are used and the obtained layers are characterized by SEM and XRF. The sheet resistance is measured in different points along the samples. It was found that the electroless deposited layers have a greater thickness in the lower part of the samples. The opposite is observed with distancing from the connecting point in the subsequent electrochemical layers and the sheet resistance increases.